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Committing the future of advanced manufacturing
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협력기관
3
Implementation of the spectral element method (“SEM”) to the particle-in-cell (“PIC”) method parallelized by the graphics processing units (“GPUs“).
연구기간
2025.09.01 ~ 2026.08.31
협약기관
Tokyo Electron Technology Solutions Limited
2
공정 플라즈마 시뮬레이션 교육용 UI 개발
연구기간
2025.06.01~2026.05.31
협약기관
(주)알트소프트
1
SiNxHy/SiOxHy Film 의 증착효율향상을 위한 Plasma 및 분자 결합 Simulation 연구
연구기간
2025.04.01~2026.03.31
협약기관
도쿄일렉트론코리아 주식회사
페이징
1
1
